Ceramic
Tapes
(See
Ceramic Tape Systems)
Silver
Conductor Pastes
Silver/Platinum
Conductor Pastes
Silver/Palladium
Conductor Pastes
Silver/Palladium/Platinum
Conductor Pastes
Platinum Conductor
Pastes
Platinum/Gold
Conductor Pastes
Gold Conductor Pastes
Specialty Conductor
Pastes
Polymer Pastes
Crossover/Multilayer
Dielectrics & Dielectric
Coatings
Capacitor Dielectric
Pastes
Resistor Pastes
Overglaze & Sealing
Dielectric Pastes
Vehicles & Thinners
Porous Cover Plates
Solder Pastes
(from ESL Europe Only)
|
| Ceramic
Tape Systems |
| Green
Products are Lead-Free, Cadmium-Free |
 |
ESL
Low Temperature Co-fired Ceramic (LTCC) Systems |
| Tape |
41010 |
41110 |
41020 |
41050 |
41060 |
| Tape
Type |
LTCC |
LTCC |
LTCC |
LTCC |
LTCC |
| Primary
Characteristic |
Intermediate
k |
Low
k |
Intermediate
k |
Higher
k |
Higher
k |
| Lead-free? |
no |
yes |
yes |
yes |
yes |
| Firing
Temperature |
875 °C |
850 °C |
875 °C |
875 °C |
875 °C |
| Dielectric
Constant |
7.3 |
4.2 |
7.4 |
13 |
16 |
| Shrinkage,
XY% |
13+/-0.5 |
13+/-0.5 |
13+/-0.5 |
9.5+/-1.0 |
9.5+/-1.0 |
| Shrinkage,
Z% |
17+/-1.0 |
16+/-1.0 |
17+/-1.0 |
15+/-1.0 |
15+/-1.0 |
| Fired
Density (g/ml) |
3.2 |
2.3 |
3.2 |
3.2 |
3.5 |
| TCE
ppm |
7 |
6.4 |
7.4 |
7.15 |
7.55 |
| Thermal
Conductivity (W/(m.K) |
3 |
3 |
3 |
- |
- |
| Loss
@ 3 GHz (dB/mm) |
0.0057 |
0.0037 |
0.0047 |
- |
- |
| Loss
@ 10 GHz(dB/mm) |
0.0183 |
0.0099 |
0.0106 |
- |
- |
| Top
Silver |
903-A |
903-A |
903-A |
903-A |
903-A |
| Groundplane
Silver |
903-B |
903-B |
903-B |
903-B |
903-B |
| Internal
Silver |
903-A |
903-A |
903-A |
903-A |
903-A |
| Solderable
Silver |
903-D |
903-C |
903-D |
903-D |
903-D |
| Via
Fill |
902 |
902 |
902 |
902 |
902 |
| Wirebondable
Gold |
803 |
803 |
803 |
803 |
803 |
| Top
Silver (Ag/Pt) |
953 |
953 |
953 |
953 |
953 |
| Top
Silver (Ag/Pd) |
963 |
963 |
963 |
963 |
963 |
|
| ESL
Capacitor Tape Systems |
| Tape |
41230 |
41240 |
41250 |
41260 |
|
| Tape
Type |
LTCC |
LTCC |
LTCC |
LTCC |
|
| Primary
Characteristic |
Capacitor |
Capacitor |
Capacitor |
Capacitor |
|
| Lead-free? |
yes |
yes |
yes |
yes |
|
| Firing
Temperature |
875 °C |
875 °C |
875 °C |
875 °C |
|
| Dielectric
Constant |
18 |
50 |
100 |
250 |
|
| Top
Silver (Ag/Pt) |
953 |
953 |
953 |
953 |
|
| Top
Silver (Ag/Pd) |
963 |
963 |
963 |
963 |
|
|
| ESL
Low Temperature Transfer Tape (LTTT) Systems |
| Tape |
41010-T |
41110-T |
41020-T |
41030-T |
41030-T-200 |
| Tape
Type |
LTTT |
LTTT |
LTTT |
LTTT |
LTTT |
| Primary
Characteristic |
Intermediate
k |
Low
k |
Intermediate
k |
430
S/S |
430
S/S |
| Lead-free? |
no |
yes |
yes |
yes |
yes |
| Firing
Temperature |
850 °C |
850 °C |
850 °C |
850 °C |
850 °C |
| Dielectric
Constant |
7.3 |
4.2 |
7.4 |
9.5 |
9.5 |
| Shrinkage,
XY% |
0 |
0 |
0 |
0 |
0 |
| Shrinkage,
Z% |
50+/-5.0 |
50+/-5.0 |
50+/-5.0 |
50+/-5.0 |
50+/-5.0 |
| Fired
Density (g/ml) |
3.1 |
2.3 |
3.1 |
2.8 |
2.8 |
| Loss
@ 3 GHz (dB/mm) |
~0.006 |
~0.004 |
~0.005 |
(thickness = 120 µm) |
(thickness = 200 µm) |
| Note that standard ESL metallizations recommended for use on alumina,
such as 9912-G,
can also be used on ESL LTTT Systems. |
|
| ESL
Specialty Tape Systems |
| Tape |
40010 |
40011 |
40012 |
42000 |
42013 |
44000 |
| Tape
Type |
LTCC |
LTCC |
LTCC |
HTCC |
HTCC |
HTCC |
| Primary
Characteristic |
Ferrite
(Magnetic) |
Ferrite
(Magnetic) |
Ferrite
(Magnetic) |
Zirconia
(3 mol% YSZ) |
Zirconia
(5 mol% YSZ) |
Alumina
(96%) |
| Lead-free? |
yes |
yes |
yes |
yes |
yes |
no |
| Firing
Temperature |
885 °C |
885 °C |
885 °C |
1450 °C |
1450 °C |
1450 °C |
| Permeability |
50 |
200 |
500 |
- |
- |
- |
| Shrinkage,
XY% |
17+/-1 |
17+/-1 |
17+/-1 |
22+/-1 |
19.5+/-1 |
17.5+/-1 |
| Shrinkage,
Z% |
14+/-1 |
16.5+/-1 |
16.5+/-1 |
22+/-1 |
19.5+/-1 |
16.5+/-1 |
| Fired
Density (g/ml) |
5.3 |
5.3 |
5.3 |
5.5 |
5.5 |
3.7 |
| TCE
ppm |
9.4 |
9.4 |
9.4 |
- |
- |
- |
| Top
Ag or Pt |
903-A |
903-A |
903-A |
5542 |
5542 |
5542 |
| Internal
Silver |
903-B |
903-B |
903-B |
- |
- |
- |
| Via
Fill |
902 |
902 |
902 |
- |
- |
- |
| Top
Silver (Ag/Pt) |
953 |
953 |
953 |
- |
- |
- |
| Top
Silver (Ag/Pd) |
963 |
963 |
963 |
- |
- |
- |
|
| ESL
Ceramic Tape Systems for SOFC |
| YSZ Electrolyte
Tape (~20µm) |
42400 |
| YSZ Electrolyte
Tape (~125µm) |
42401 |
| ScSZ Electrolyte
Tape (~20µm) |
42405 |
| ScSZ Electrolyte
Tape (~125µm) |
42402 |
| NiO/YSZ Anode
Tape |
42420 |
| Porous NiO/YSZ Anode
Tape |
42421 |
| YSZ Electrolyte Paste |
4481 |
| ScSZ Electrolyte Paste |
4345 |
| GDC Electrolyte Paste |
4343 |
| Nickel Oxide Anode
Paste |
4410 |
| Nickel Oxide Anode
Paste with added Pore-Former |
4411 |
| Nickel Oxide (50 mol%)/Zirconia Anode (50 mol%)
Paste |
4412 |
| Nickel Oxide (65 mol%)/Zirconia (35 mol%)Anode
Paste |
4416 |
| LSM Cathode
Paste |
4420 |
| LSCF Cathode
Paste |
4421 |
| LSM/Zirconia Cathode
Paste |
4422 |
| LCC Interconnect Paste |
4480 |
| LSCC Interconnect Paste |
4482 |
| Pt Interconnect
Paste |
5542 |
| Ag Interconnect
Paste |
9906 |
| Ag-Pd Interconnect
Paste |
9627 |
| Ag-Pt Interconnect
Paste |
9512-G |
| Au Interconnect
Paste |
8884-G |
| Porosity-Forming
Paste |
4440 |
| Brazing
Paste |
2323 |
|
|
The
above tapes and pastes are selected from the full ESL
range and are representative of the most common market
requirements. If you are seeking properties or characteristics
not shown above, please contact
ESL.
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