Applications
Defense & Aerospace
| Product | Purpose | Order Trial Quantity |
|
|---|---|---|---|
| 8835-1A |
Gold
Conductor Alloyed gold for both Au and Al wire bonding |
||
| 8835-1B | Gold
Conductor General purpose, high adhesion, excellent line definition for Au wire bonding up to 33 µm |
||
| 8844-G | Gold
Conductor General purpose for use on alumina and 4920 dielectric, gives thin, smooth and dense films, excellent results with thermosonic gold wire bonding |
||
| 8844 | Gold
Conductor General purpose, Cd-free, fritless, 850 °C firing |
||
| 8846-G | Gold
Conductor General purpose, alloyed, for aluminum wire bonding use on alumina and 4920, gives thin, smooth and dense films, excellent results with thermosonic gold wire bonding |
||
| 8881-B | Gold
Conductor Etchable, fritless, 850 °C firing, thin printing (6 - 8 µm), dense film for 25 µm Au wire bonding |
||
| 8881-BA | Gold
Conductor Etchable, fritless, 850 °C firing, thin printing (6 - 8 µm), alloyed Au for 25 µm Al wire bonding |
||
| 8884 | Gold
Conductor Fritless, 850 °C firing, for power applications on alumina or beryllia |
||
| 8884-G | Gold
Conductor Excellent wire bonding and conductivity, fritless, 850 °C firing |
||
| 5542 | Platinum
Conductor Porous electrode material for use on partially stabilized zirconia |
||
| 5837-G | Platinum-Gold Conductor Solderable both on alumina and when printed and fired over 4917 dielectric, can also be used on beryllia |
||
| 5837 | Platinum-Gold
Conductor For use on alumina, solderable |
||
| 5837-A | Platinum-Gold
Conductor For use on multilayer dielectric, solderable |
||
| 9912-THP | Silver
Through Hole Through-hole applications in alumina substrates |
||
| 8835 VF-G | Gold Via Fill For multilayers |
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| R-300-A/B series | Resistor
Series For resistors, two series, blendable in the resistivity ranges 1 - 10 kohm/sq. and 10 k - 1 Mohm/sq. |
||
| 4905-C | Multilayer
Dielectric Filled glass-ceramic, for use with gold conductors |
||
| 4911 | Multilayer
Dielectric Multilayer dielectric, for high-frequency, low-loss applications, k = 4 |
||
| 4917 | Multilayer
Dielectric Multilayer dielectric, suitable for mixed metals, high BDV |
||
| 4920 | Multilayer
Dielectric Thin printing, suitable for mixed metals, high BDV |
||
| 4612-B | Overglaze
& Crossover Dielectric Alkali-free, crystallizing, green color |
||
| G-481 | Overglaze Acid resistant, excellent silver migration protection, green, 600 °C |
||
| G-482 | Overglaze Black version of G-481 |
||
| 4771-P2 | Overglaze Resistor overglaze, fires 525 - 625 °C |
See
also ESL Capacitor Dielectric
Pastes and ESL Tape
Systems
Green Products are Lead-Free, Cadmium-Free
The above ESL materials are representative of the most common market requirements. The front-side and back-side silvers are available in a number of versions, depending on factors such as the type of silicon (single crystal, poly- or multi-crystalline, etc.), the nature of the anti-reflective coating (silicon nitride, titanium dioxide, etc.) and the paste application method (screen printing, etc.)
Green Products are Lead-Free, Cadmium-Free
The above ESL materials are representative of the most common market requirements. The front-side and back-side silvers are available in a number of versions, depending on factors such as the type of silicon (single crystal, poly- or multi-crystalline, etc.), the nature of the anti-reflective coating (silicon nitride, titanium dioxide, etc.) and the paste application method (screen printing, etc.)








