ElectroScience - Thick-Film Materials & Ceramic TapesElectroScience - Thick-Film Materials & Ceramic Tapes

Products

Gold Conductor Pastes

Product Purpose PDF Order Trial
Quantity
8081-C
Thin-printing metallo-organic gold
8813-G For use on aluminum nitride (AlN), can be used for 25 and 50 µm gold wire bonding
8831-UF Pure gold for use over other conductors or dielectrics, or in LTCC tape
8835 VF-G Multilayer Via Fill
8837-G Very thin printing (1-2 µm), wire bondable
8844-G General purpose for use on alumina and 4920 dielectric, gives thin, smooth and dense films, excellent results with thermosonic gold wire bonding
8846-G General purpose, alloyed, for aluminum wire bonding use on alumina and 4920, gives thin, smooth and dense films, excellent results with thermosonic gold wire bonding
8847 For printing on alumina, excellent line definition, surface smoothness, printability, and gold wire bonding properties
8880-G Excellent wire bonding and conductivity, fritless, 980 °C firing
8884-G Excellent wire bonding and conductivity, fritless, 850 °C firing
8886 Etchable, thin fired film (1 µm), for use on glazed ceramics
803 For use in LTCC systems
8081-A Metallo-organic, <1 µm fired thickness on alumina
8835 (520C) 520 °C firing on glass and ceramic substrates
8835-1A Alloyed gold for both Au and Al wire bonding
8835-1B General purpose, high adhesion, excellent line definition, for Au wire bonding up to 33 µm
8835-1D General purpose for use on aluminum nitride
8836 Thinner printing version of 8835-1B
8836-F Shorter firing cycle version of 8836 (13 minutes)
8838-VF Hole plug fill
8844 General purpose, Cd-free, fritless, 850 °C firing
8880 Low resistivity <3 mohm/sq., etchable, microwave applications, 980 °C firing, fritless, for general use, including use in fuel cells
8881-B Etchable, fritless, 850 °C firing, thin printing (6-8 µm), dense film for 25 µm Au wire bonding
8881-BA Etchable, fritless, 850 °C firing, thin printing (6-8 µm), alloyed Au for 25 µm Al wire bonding
8884 Fritless, 850 °C firing, for power applications on alumina or beryllia
8884-A Fritless, 850 °C firing, alloyed gold, for power applications on alumina or beryllia, 250 µm Al wire bonding
Green Products are Lead-Free, Cadmium-Free

The above ESL materials are representative of the most common market requirements. ESL offers many other thick-film and ceramic tape products for specialized use which are not on this web site. ESL can also develop new materials to meet customer's specifications and needs. Please contact your nearest ESL representative listed on the Contact page for further information.