Products
Gold Conductor Pastes
| Product | Purpose | Order Trial Quantity |
|
|---|---|---|---|
| 8081-C |
Thin-printing metallo-organic gold |  |
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| 8813-G | For use on aluminum nitride (AlN), can be used for 25 and 50 µm gold wire bonding | |
|
| 8831-UF | Pure gold for use over other conductors or dielectrics, or in LTCC tape | |
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| 8835 VF-G | Multilayer Via Fill | |
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| 8837-G | Very thin printing (1-2 µm), wire bondable | |
|
| 8844-G | General purpose for use on alumina and 4920 dielectric, gives thin, smooth and dense films, excellent results with thermosonic gold wire bonding | |
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| 8846-G | General purpose, alloyed, for aluminum wire bonding use on alumina and 4920, gives thin, smooth and dense films, excellent results with thermosonic gold wire bonding | |
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| 8847 | For printing on alumina, excellent line definition, surface smoothness, printability, and gold wire bonding properties | |
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| 8880-G | Excellent wire bonding and conductivity, fritless, 980 °C firing | |
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| 8884-G | Excellent wire bonding and conductivity, fritless, 850 °C firing | |
|
| 8886 | Etchable, thin fired film (1 µm), for use on glazed ceramics | |
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| 803 | For use in LTCC systems | |
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| 8081-A | Metallo-organic, <1 µm fired thickness on alumina | |
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| 8835 (520C) | 520 °C firing on glass and ceramic substrates | |
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| 8835-1A | Alloyed gold for both Au and Al wire bonding | |
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| 8835-1B | General purpose, high adhesion, excellent line definition, for Au wire bonding up to 33 µm | |
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| 8835-1D | General purpose for use on aluminum nitride | |
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| 8836 | Thinner printing version of 8835-1B | |
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| 8836-F | Shorter firing cycle version of 8836 (13 minutes) | |
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| 8838-VF | Hole plug fill | |
|
| 8844 | General purpose, Cd-free, fritless, 850 °C firing | |
|
| 8880 | Low resistivity <3 mohm/sq., etchable, microwave applications, 980 °C firing, fritless, for general use, including use in fuel cells | |
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| 8881-B | Etchable, fritless, 850 °C firing, thin printing (6-8 µm), dense film for 25 µm Au wire bonding | |
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| 8881-BA | Etchable, fritless, 850 °C firing, thin printing (6-8 µm), alloyed Au for 25 µm Al wire bonding | |
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| 8884 | Fritless, 850 °C firing, for power applications on alumina or beryllia | |
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| 8884-A | Fritless, 850 °C firing, alloyed gold, for power applications on alumina or beryllia, 250 µm Al wire bonding | |
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Green Products are Lead-Free, Cadmium-Free
The above ESL materials are representative of the most common market requirements. ESL offers many other thick-film and ceramic tape products for specialized use which are not on this web site. ESL can also develop new materials to meet customer's specifications and needs. Please contact your nearest ESL representative listed on the Contact page for further information.
The above ESL materials are representative of the most common market requirements. ESL offers many other thick-film and ceramic tape products for specialized use which are not on this web site. ESL can also develop new materials to meet customer's specifications and needs. Please contact your nearest ESL representative listed on the Contact page for further information.