| Gold
Conductor Pastes |
| Green
Products are Lead-Free, Cadmium-Free |
Order
Trial Quantity |
| Product |
Purpose |
PDF |
 |
803
|
For use in LTCC systems |
 |
 |
8081-C
|
Thin-printing metallo-organic gold |
|
|
| 8831-UF |
Pure gold for use over other conductors or dielectrics,
or in LTCC tape |
|
|
| 8837-G |
Very thin printing (1-2 µm), wire bondable |
|
|
| 8844-G |
General purpose for use on alumina and 4920 dielectric, gives thin, smooth and dense films, excellent results with thermosonic gold wire bonding |
|
|
| 8846-G |
General purpose, alloyed, for aluminum wire bonding use on alumina and 4920, gives thin, smooth and dense films, excellent results with thermosonic gold wire bonding |
|
|
| 8847 |
For printing on alumina, excellent line definition, surface smoothness, printability, and gold wire bonding properties |
|
|
| 8880-G |
Excellent wire bonding and conductivity, fritless, 980 °C
firing |
|
|
| 8884-G |
Excellent wire bonding and conductivity, fritless, 850 °C
firing |
|
|
| 8886 |
Etchable, thin fired film (1 µm), for use on glazed ceramics |
|
|
| 8081-A |
Metallo-organic,
<1 µm fired thickness on alumina |
|
|
| 8813-G |
For use on aluminum nitride (AlN), can be used for 25 and 50 µm gold wire bonding |
|
|
| 8835
(520C) |
520 °C
firing on glass and ceramic substrates |
|
|
| 8835-1A |
Alloyed
gold for both Au and Al wire bonding |
|
|
| 8835-1B |
General
purpose, high adhesion, excellent line definition, for
Au wire bonding up to 33 µm |
|
|
| 8835-1D |
General
purpose for use on aluminum nitride |
|
|
| 8835-VIA
FILL |
Multilayer
Via Fill |
|
|
| 8836 |
Thinner
printing version of 8835-1B |
|
|
| 8836-F |
Shorter
firing cycle version of 8836 (13 minutes) |
|
|
| 8838-VF |
Hole
plug fill |
|
|
| 8844 |
General
purpose, Cd-free, fritless, 850 °C firing |
|
|
| 8880 |
Low
resistivity <3 mohm/sq., etchable, microwave applications,
980 °C firing, fritless, for general use, including
use in fuel cells |
|
|
| 8881-B |
Etchable,
fritless, 850 °C firing, thin printing (6-8 µm),
dense film for 25 µm Au wire bonding |
|
|
| 8881-BA |
Etchable,
fritless, 850 °C firing, thin printing (6-8 µm),
alloyed Au for 25 µm Al wire bonding |
|
|
| 8884 |
Fritless,
850 °C firing, for power applications on alumina or
beryllia |
|
|
| 8884-A |
Fritless,
850 °C firing, alloyed gold, for power applications
on alumina or beryllia, 250 µm Al wire bonding |
|
|
|
The
above pastes are selected from the full ESL range and
are representative of the most common market requirements.
If you are seeking properties or characteristics not
shown above, please contact ESL.
|
