| Silver/Palladium
Conductor Pastes |
| Green
Products are Lead-Free, Cadmium-Free |
Order
Trial Quantity |
| Product |
Purpose |
PDF |
 |
9627
|
Silver-palladium, for use as an interconnect paste in SOFC and other fuel cells |
 |
 |
9633-G
|
2/1, excellent leach and migration resistance |
|
|
9635-HG
|
General purpose 6/1 for use on alumina and on dielectric, excellent solderability over ESL dielectrics |
|
|
| 9647 |
3/1, excellent solderability and large Al wire bondability |
|
|
| 9693-G |
Low cost, general purpose |
|
|
| 9695-G |
Low cost, high conductivity, for use on alumina, and as a termination for 29XXX resistors over dielectric on stainless steel |
|
|
| C-964-G |
For general use in hybrid circuit and component manufacture, smooth surface, good adhesion, excellent solderability and leach resistance |
|
|
| 9633-I |
For
use on aluminum nitride |
|
|
| 963 |
Solderable,
with excellent leach resistance, for use in LTCC systems |
|
|
| 9635-B |
3/1,
general purpose |
|
|
| 9635-H |
6/1,
excellent aged adhesion, Cd-free |
|
|
| 9638 |
3/1,
electrode for 4100 Series capacitor dielectrics |
|
|
| 9693-S-A |
For
high-speed printing, excellent adhesion and solderability |
|
|
| 9694-SA |
High-speed printing cadmium-free palladium silver conductor, excellent adhesion, good solderability, and high conductivity |
|
|
| 9695 |
20/1,
wide firing range 625-930 °C |
|
|
| 9695-P |
For use in potentiometer applications, excellent wear resistance, solderability and adhesion |
|
|
| C-964-A |
Excellent
solderability and leach resistance, compatible with 8835-1B,
4920 |
|
|
|
The
above pastes are selected from the full ESL range and
are representative of the most common market requirements.
If you are seeking properties or characteristics not
shown above, please contact ESL.
|
